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Thermal Design of a Rear Door Rack |
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| An electronic enclosure manufacturer, AMCO Engineering of Illinois, is developing two new enclosure designs for data center applications. AMCO wanted a rear door design that was capable of handing the thermal requirement of 13 KW in each rack. Furthermore, within each rack, various configurations of cards are possible, greatly affecting the thermal and airflow patterns. The challenge was to design one solution that met all situations. The internal circulation within the racks needs to be minimized as well as minimizing temperature stratification within the rack. IQS was asked to design a rear door solution that met all of these requirements. |
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Thermal Analysis of a 10gig Chassis |
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| The customer learned that the system airflow was not fully balanced, and particular areas of the PC board were running too hot if the new devices were added into the existing design. |
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Thermal Analysis of a Heat Sink |
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| The customer learned that the main power dissipation device would exceed the operating temperature limit. |
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Thermal Analysis of Components |
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| The customer assumed that 100% of the power available was going to be used in the system. IQS determined several device temperatures were exceeding their limits in this operating environment (see Figure 1). However, IQS’s analysis showed that only 50-60% of the power was being used. |
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Airflow Evaluation of a Chassis |
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| The customer requested a comprehensive experimental airflow evaluation to compare to a CFD modeling effort performed a few months earlier. The objective was to verify key recommendations made as a result of an initial CFD model, detect the presence of adequate airflow in the chassis, as well as validate correlation between the actual chassis and the first pass CFD model. IQS was also asked to evaluate different air mover vendors plus determining if the presence of a flow straightener would improve the airflow distribution. |
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